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Die Attach
Semi-Automatic die attach systems with programmable dispenser. Semi-Automatic Eutectic Die Attach. |
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Wafer Mounter
Manual and Semi-Automatic mounters for wafers up to 8 inches diameter. Contact and non-contact methods available. |
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Die Coating
Automatic and Semi-Automatic systems for die coating. Single magazine indexer for all leadframe sizes. Available with in line UV curing system for applications requiring UV curable materials. |
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Scribe and Break
Automatic system for scribe and break of Silicon wafers, GaAs Wafers, Glass and other materials. |
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Wafer/Substrate Fracturer
Semi-Automatic system for wafer break or substrate break applications. |
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Wire Bond Pull Tester
Manual low-cost wire bond pull tester. |
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UV Tape Curing Systems
Automatic and Semi-Automatic systems for UV curing of UV Wafer Tapes. |
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Wafer Cleaner
Contact and non-contact wafer cleaners for wafers up to 8 inches diameter. |
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Wafer Expander
Temperature controlled piston ram accommodates wafers mounted on film frames or rings. |
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Backlapping Film Applicator
Semi-Automatic system for mounting backlapping films. Semi-Automatic system for removal of backlapping films. |
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Leadframe Assembly Equipment
Manual, Semi-Automatic and Fully Automatic systems for lead attach for SIP, DIP, and Quad packages. |
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Fiber Optic Assembly
Fully automatic systems for fiber optic array devices, laser modules, optical waveguides. |
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UV Epoxy or Laser Attach
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Eccentricity Measurement Systems
Non-contact, automated measurement systems for WDM devices, single or multiple ferrules. |