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Wafer Dicing Films
Adhesive films for Dicing or Scribing of wafers. Full range of adhesive strength (low, medium, high tack). UV Curable Films. |
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Underfill Encapsulant
Fast flow, low temperature epoxy underfill material for use in Chip-On Board assembly. Low Coefficient of Thermal Expansion make it ideal for Flip Chip attachment on flex circuits, organic and ceramic substrates. |
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Conductive "Polysolder" Adhesive
Unique, patented silver filled epoxy. Processing temperature as low as 130C. Applications for die attach and as a component attach replacement for solder on rigid boards. |
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Moisture/Particle/Hydrogen Getters
Moisture Getter material for hermetic packages. Moisture/Particle Getter material for PIND Testing. Hydrogen Getters for GaAs die in Hermetic Packages. |
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Gold/Tin Preforms
Preforms for Eutectic Die Attach applications. |
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Backlapping Films
Adhesive Films for backlapping, thinning and lapping. |
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Stamped Leadframes
Precision stamped leadframes for SIP, DIP, ZIP,Quads, Surface Mount, Thru-hole and Solder-laden. Wide variety of base materials and platings available. Custom designs and custom plating also available |
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Precision Metal Stampings
Precision Metal Stampings for all applications. Parts are available in continuous coil or loose piece. Design and manufacture of die for any custom metal stamping applications. |
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Fiber Optic Materials
Microball lenses, aspherical lenses, v-groove glocks, optical fiber arrays, pig-tail assemblies. |